Invention Grant
- Patent Title: Resistance welded junction for medical electrical leads
- Patent Title (中): 医用电线电阻焊接头
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Application No.: US10717721Application Date: 2003-11-20
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Publication No.: US08670838B2Publication Date: 2014-03-11
- Inventor: Daniel R. Pavlik , Jordon D. Honeck
- Applicant: Daniel R. Pavlik , Jordon D. Honeck
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Agent Reed A. Duthler; Stephen W. Bauer
- Main IPC: A61N1/02
- IPC: A61N1/02
Abstract:
A medical electrical lead component includes a groove formed in a surface of the component. The medical electrical lead includes a portion of a conductor positioned within the groove and a resistance weld formed between the portion of the conductor positioned within the groove and the component. In one embodiment, the portion of the conductor positioned within the groove includes a pre-weld diameter greater than the depth of the groove.
Public/Granted literature
- US20050113896A1 Novel welded junction for medical electrical leads Public/Granted day:2005-05-26
Information query
