Invention Grant
- Patent Title: Substrate for flip chip bonding and method of fabricating the same
- Patent Title (中): 倒装芯片接合用基板及其制造方法
-
Application No.: US12554762Application Date: 2009-09-04
-
Publication No.: US08671564B2Publication Date: 2014-03-18
- Inventor: Hueng Jae Oh , Tae Joon Chung , Dong Gyu Lee , Seon Jae Mun , Jin Won Choi
- Applicant: Hueng Jae Oh , Tae Joon Chung , Dong Gyu Lee , Seon Jae Mun , Jin Won Choi
- Applicant Address: KR Gyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Gyunggi-Do
- Agency: Bracewell & Giuliani LLP
- Priority: KR10-2009-0051605 20090610
- Main IPC: H01K3/10
- IPC: H01K3/10
Abstract:
Disclosed is a substrate for flip chip bonding, in which a base solder layer is formed between a pad and a metal post, thereby increasing impact resistance and mounting reliability. A method of fabricating the substrate for flip chip bonding is also provided.
Public/Granted literature
- US20100314161A1 SUBSTRATE FOR FLIP CHIP BONDING AND METHOD OF FABRICATING THE SAME Public/Granted day:2010-12-16
Information query
