Invention Grant
- Patent Title: Method for manufacturing a probe for an electrical test
- Patent Title (中): 制造电气试验用探针的方法
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Application No.: US12939879Application Date: 2010-11-04
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Publication No.: US08671567B2Publication Date: 2014-03-18
- Inventor: Hideki Hirakawa , Satoshi Kaizuka
- Applicant: Hideki Hirakawa , Satoshi Kaizuka
- Applicant Address: JP Musashino-shi, Tokyo
- Assignee: Kabushiki Kaisha Nihon Micronics
- Current Assignee: Kabushiki Kaisha Nihon Micronics
- Current Assignee Address: JP Musashino-shi, Tokyo
- Agency: Ingrassia Fisher & Lorenz, P.C.
- Priority: JP2009-263904 20091119
- Main IPC: H01R43/00
- IPC: H01R43/00

Abstract:
A method for manufacturing a probed for an electrical test includes producing by a deposition technique a deposit including a probe main body portion made of a nickel-boron alloy and a probe tip portion projecting downward from the probe main body portion and made of a different conductive material from the probe main body portion. The method further includes annealing the deposit. The average grain diameter of the nickel-boron alloy is between 97 Å and 170 Å. The contained amount of boron is from 0.02 wt % to 0.20 wt %.
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