A multi-layered honeycomb structure adapted to reduce and/or eliminate thermal deformation is disclosed herein. In some embodiments, walls of the honeycomb structure comprise a first layer, optionally, a second layer, and a core layer adjacent to the first layer or between the first and second layers. The first and second layers may be compositions of Inconel or other high strength materials. The core layer may be copper or another thermally conductive material. The core layer is adapted to transmit heat between a first region of a structure and a second region. In this manner, heat can be transferred from the heated region to an unheated region, thereby reducing the temperature difference between the regions and thus the amount of thermal deformation.