Invention Grant
- Patent Title: Heat pump
- Patent Title (中): 热泵
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Application No.: US12846626Application Date: 2010-07-29
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Publication No.: US08671706B2Publication Date: 2014-03-18
- Inventor: Simwon Chin , Eungyul Lee , Younghwan Ko , Sangkyoung Park
- Applicant: Simwon Chin , Eungyul Lee , Younghwan Ko , Sangkyoung Park
- Applicant Address: KR Seoul
- Assignee: LG Electronics Inc.
- Current Assignee: LG Electronics Inc.
- Current Assignee Address: KR Seoul
- Agency: McKenna Long & Aldridge LLP
- Priority: KR10-2009-0111603 20091118
- Main IPC: F25B13/00
- IPC: F25B13/00 ; F25B5/00 ; F25B1/10 ; F25B43/00 ; F24F3/153

Abstract:
A heat pump according to the present invention comprises a plurality of the compression chambers, and compresses refrigerant with multistage, and injects vapor refrigerant into the space between the plurality of the compression chambers by using the first refrigerant injection flow path and the second refrigerant injection flow path. Performance and efficiency of the heat pump can be improved compared with non-injection, as flow rate of the refrigerant circulating the indoor heat exchanger is increased. Thus heating performance can be improved also in the extremely cold environmental condition such as the cold area by increasing the injection flow rate. Also, because the heat pump according to the present invention comprises the first refrigerant injection flow path and the second refrigerant injection flow path, refrigerant is injected twice. Thus, as the injection flow rate of the refrigerant is increased, heating capacity can be improved. Also, the difference between the suction pressure and the discharge pressure of the rotary compressor may be decreased, and thus the reliability and the performance of the rotary compressor can be improved.
Public/Granted literature
- US20110113804A1 HEAT PUMP Public/Granted day:2011-05-19
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