Invention Grant
- Patent Title: Light-emitting module
- Patent Title (中): 发光模块
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Application No.: US13452752Application Date: 2012-04-20
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Publication No.: US08672517B2Publication Date: 2014-03-18
- Inventor: Chia-Tin Chung , Shen-Ta Yang
- Applicant: Chia-Tin Chung , Shen-Ta Yang
- Applicant Address: TW New Taipei
- Assignee: Paragon Semiconductor Lighting Technology Co., Ltd.
- Current Assignee: Paragon Semiconductor Lighting Technology Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Li & Cai Intellectual Property (USA) Office
- Priority: TW100207227U 20110422
- Main IPC: F21V29/00
- IPC: F21V29/00 ; H01L23/34
Abstract:
A light-emitting module includes a heat-dissipating structure, a multichip package structure and a protection cover structure. The multichip package structure is disposed on the heat-dissipating structure, and the multichip package structure includes a substrate unit, a light-emitting unit, a frame unit and a package unit. The protection cover structure is disposed on the heat-dissipating structure to cover and protect the multichip package structure, and the protection cover structure has an opening for exposing the package unit.
Public/Granted literature
- US20120268929A1 LIGHT-EMITTING MODULE Public/Granted day:2012-10-25
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