Invention Grant
- Patent Title: Shield and circuit board module having the same
- Patent Title (中): 屏蔽和电路板模块具有相同的功能
-
Application No.: US13450569Application Date: 2012-04-19
-
Publication No.: US08672712B2Publication Date: 2014-03-18
- Inventor: Kimihiro Matsuoka
- Applicant: Kimihiro Matsuoka
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: Posz Law Group, PLC
- Priority: JP2011-99506 20110427
- Main IPC: H01R13/648
- IPC: H01R13/648

Abstract:
A shield is made of a conductive material and used to cover a connector fixed to a circuit board. The shield includes a shield body, a contact portion and a lock portion. The shield body covers an outside of the connector. The contact portion projects from the shield body toward inside of the shield body to contact a ground terminal of the connector. The contact portion is elastically deformable and applies a pressing force toward the connector. The lock portion projects from the shield body toward outside of the shield body. The lock portion is brought into contact with the connector by a reaction force exerted to the shield body due to the pressing force, thereby to restrict the shield body from being moved relative to the connector due to the reaction force.
Public/Granted literature
- US20120276757A1 SHIELD AND CIRCUIT BOARD MODULE HAVING THE SAME Public/Granted day:2012-11-01
Information query