Invention Grant
- Patent Title: Low-temperature sintered silver nanoparticle composition and electronic articles formed using the same
- Patent Title (中): 低温烧结银纳米颗粒组合物和使用其形成的电子制品
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Application No.: US13321675Application Date: 2010-08-27
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Publication No.: US08673049B2Publication Date: 2014-03-18
- Inventor: Gregory A. Jablonski , Michael A. Mastropietro , Kimitaka Sato , Hiromasa Miyoshi , Hidefumi Fujita
- Applicant: Gregory A. Jablonski , Michael A. Mastropietro , Kimitaka Sato , Hiromasa Miyoshi , Hidefumi Fujita
- Applicant Address: JP Tokyo US PA Bensalem
- Assignee: DOWA Electronics Materials Co., Ltd.,PChem Associates, Inc.
- Current Assignee: DOWA Electronics Materials Co., Ltd.,PChem Associates, Inc.
- Current Assignee Address: JP Tokyo US PA Bensalem
- Agency: Greenblum & Bernstein, P.L.C.
- International Application: PCT/JP2010/064556 WO 20100827
- International Announcement: WO2012/026033 WO 20120301
- Main IPC: C22C5/00
- IPC: C22C5/00

Abstract:
A silver nanoparticle composition is provided which is possible to be sintered through sintering at a low temperature in a short time and to form silver electro conductive film and wiring which is favorable for adhesion to a substrate and low in resistance, and articles using the same are provided. The silver nanoparticle composition is provided, wherein a main component of a solvent is water, a pH of the composition is within a range of 5.3 to 8.0, a silver nanoparticle included in the composition is protected by an organic acid or a derivative thereof, and the content of the organic acid or the derivative thereof with respect to silver is 2 to 20% by mass.
Public/Granted literature
- US20120177897A1 LOW-TEMPERATURE SINTERED SILVER NANOPARTICLE COMPOSITION AND ELECTRONIC ARTICLES FORMED USING THE SAME Public/Granted day:2012-07-12
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