Invention Grant
US08673050B2 Conductive material, conductive paste, circuit board, and semiconductor device 有权
导电材料,导电膏,电路板和半导体器件

Conductive material, conductive paste, circuit board, and semiconductor device
Abstract:
A conductive material includes a first metal part whose main ingredient is a first metal; a second metal part formed on the first metal part and whose main ingredient is a second metal, the second metal having a melting point lower than a melting point of the first metal, which second metal can form a metallic compound with the first metal; and a third metal part whose main ingredient is a third metal, which third metal can make a eutectic reaction with the second metal.
Information query
Patent Agency Ranking
0/0