Invention Grant
- Patent Title: Conductive material, conductive paste, circuit board, and semiconductor device
- Patent Title (中): 导电材料,导电膏,电路板和半导体器件
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Application No.: US12850950Application Date: 2010-08-05
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Publication No.: US08673050B2Publication Date: 2014-03-18
- Inventor: Seiki Sakuyama , Taiji Sakai
- Applicant: Seiki Sakuyama , Taiji Sakai
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Main IPC: B22F1/02
- IPC: B22F1/02 ; H01B1/02 ; H01B1/22

Abstract:
A conductive material includes a first metal part whose main ingredient is a first metal; a second metal part formed on the first metal part and whose main ingredient is a second metal, the second metal having a melting point lower than a melting point of the first metal, which second metal can form a metallic compound with the first metal; and a third metal part whose main ingredient is a third metal, which third metal can make a eutectic reaction with the second metal.
Public/Granted literature
- US20100315796A1 CONDUCTIVE MATERIAL, CONDUCTIVE PASTE, CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE Public/Granted day:2010-12-16
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