Invention Grant
- Patent Title: Laser processing method
- Patent Title (中): 激光加工方法
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Application No.: US13361079Application Date: 2012-01-30
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Publication No.: US08673167B2Publication Date: 2014-03-18
- Inventor: Hideki Shimoi , Hiroyuki Kyushima , Keisuke Araki
- Applicant: Hideki Shimoi , Hiroyuki Kyushima , Keisuke Araki
- Applicant Address: JP Hamamatsu-shi, Shizuoka
- Assignee: Hamamatsu Photonics K.K.
- Current Assignee: Hamamatsu Photonics K.K.
- Current Assignee Address: JP Hamamatsu-shi, Shizuoka
- Agency: Drinker Biddle & Reath LLP
- Priority: JP2010-167434 20100726
- Main IPC: B44C1/22
- IPC: B44C1/22 ; C03C15/00 ; C03C25/68 ; C23F1/00

Abstract:
A laser processing method for forming a hole in a sheet-like object to be processed made of silicon comprises a depression forming step of forming a depression in a part corresponding to the hole on a laser light entrance surface side of the object, the depression opening to the laser light entrance surface; a modified region forming step of forming a modified region along a part corresponding to the hole in the object by converging a laser light at the object after the depression forming step; and an etching step of anisotropically etching the object after the modified region forming step so as to advance the etching selectively along the modified region and form the hole in the object; wherein the modified region forming step exposes the modified region or a fracture extending from the modified region to an inner face of the depression.
Public/Granted literature
- US20120125892A1 LASER PROCESSING METHOD Public/Granted day:2012-05-24
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