Invention Grant
- Patent Title: Mechanical isolation for MEMS electrical contacts
- Patent Title (中): MEMS电触点的机械隔离
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Application No.: US12790646Application Date: 2010-05-28
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Publication No.: US08674460B2Publication Date: 2014-03-18
- Inventor: Roman C. Gutierrez , Robert J. Calvet
- Applicant: Roman C. Gutierrez , Robert J. Calvet
- Applicant Address: US CA Arcadia
- Assignee: DigitalOptics Corporation MEMS
- Current Assignee: DigitalOptics Corporation MEMS
- Current Assignee Address: US CA Arcadia
- Agency: Haynes and Boone, LLP
- Main IPC: H01L27/14
- IPC: H01L27/14 ; H01L29/82 ; H01L29/84
Abstract:
In accordance with the disclosure, a MEMS substrate is provided that includes: a central planar portion configured to support a MEMS device; and a first electrical pad coplanar with the central planar portion, the first pad being connected to the central planar portion through a first flexure, wherein the first flexure is configured to substantially mechanically isolate the first electrical pad from the central planar portion.
Public/Granted literature
- US20100308431A1 Mechanical Isolation For MEMS Electrical Contacts Public/Granted day:2010-12-09
Information query
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