Invention Grant
US08674464B2 MEMS component, method for producing a MEMS component, and method for handling a MEMS component
有权
MEMS部件，用于制造MEMS部件的方法以及用于处理MEMS部件的方法
- Patent Title: MEMS component, method for producing a MEMS component, and method for handling a MEMS component
- Patent Title (中): MEMS部件，用于制造MEMS部件的方法以及用于处理MEMS部件的方法
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Application No.: US12842677Application Date: 2010-07-23
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Publication No.: US08674464B2Publication Date: 2014-03-18
- Inventor: Wolfgang Pahl , Gregor Feiertag , Anton Leidl
- Applicant: Wolfgang Pahl , Gregor Feiertag , Anton Leidl
- Applicant Address: DE Munich
- Assignee: Epcos AG
- Current Assignee: Epcos AG
- Current Assignee Address: DE Munich
- Agency: Slater & Matsil, L.L.P.
- Priority: DE102008005686 20080123
- Main IPC: H01L21/00
- IPC: H01L21/00 ; G01L9/00
Abstract:
A MEMS component includes a substrate in which at least one cavity is present. The cavity is closed off toward an active side of the substrate. An inactive side is arranged opposite the active side of the substrate, and the substrate is covered with a covering film on the inactive side.
Public/Granted literature
- US20110018076A1 MEMS Component, Method for Producing a MEMS Component, and Method for Handling a MEMS Component Public/Granted day:2011-01-27
Information query
IPC分类:
