In one embodiment, a semiconductor package includes a generally planar die paddle or die pad that defines multiple peripheral edge segments, and includes one or more tie bars protruding therefrom. In addition, the semiconductor package includes a plurality of leads, portions of which protrude from respective side surfaces of a package body of the semiconductor package. Connected to the top surface of the die pad is at least one semiconductor die which is electrically connected to at least some of the leads. At least portions of the die pad, the leads, and the semiconductor die are encapsulated by the package body. The one or more tie bars and the plurality of leads include downsets that are sized and oriented relative to each other to facilitate enhanced manufacturing.