Invention Grant
- Patent Title: Package systems having a eutectic bonding material and manufacturing methods thereof
- Patent Title (中): 具有共晶接合材料的封装体系及其制造方法
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Application No.: US13035607Application Date: 2011-02-25
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Publication No.: US08674495B2Publication Date: 2014-03-18
- Inventor: Chia-Pao Shu , Chun-Wen Cheng , Kuei-Sung Chang , Hsin-Ting Huang , Shang-Ying Tsai , Jung-Huei Peng
- Applicant: Chia-Pao Shu , Chun-Wen Cheng , Kuei-Sung Chang , Hsin-Ting Huang , Shang-Ying Tsai , Jung-Huei Peng
- Applicant Address: TW
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW
- Agency: Lowe Hauptman & Ham, LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52
Abstract:
A package system includes a first substrate. A second substrate is electrically coupled with the first substrate. At least one electrical bonding material is disposed between the first substrate and the second substrate. The at least one electrical bonding material includes a eutectic bonding material. The eutectic bonding material includes a metallic material and a semiconductor material. The metallic material is disposed adjacent to a surface of the first substrate. The metallic material includes a first pad and at least one first guard ring around the first pad.
Public/Granted literature
- US20120086127A1 PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF Public/Granted day:2012-04-12
Information query
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