Invention Grant
- Patent Title: Circuit board, fabricating method thereof and package structure
- Patent Title (中): 电路板，其制造方法和封装结构
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Application No.: US13253088Application Date: 2011-10-05
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Publication No.: US08674503B2Publication Date: 2014-03-18
- Inventor: Pai-Sheng Cheng , Chia-Hui Wu
- Applicant: Pai-Sheng Cheng , Chia-Hui Wu
- Applicant Address: TW Xinshi Dist., Tainan
- Assignee: Himax Technologies Limited
- Current Assignee: Himax Technologies Limited
- Current Assignee Address: TW Xinshi Dist., Tainan
- Agent Winston Hsu; Scott Margo
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L23/28 ; H01L29/40
Abstract:
The present invention provides a circuit board including a substrate, at least one lead, at least one bump, and a solder layer. The lead is disposed on the substrate, and the bump is disposed on the lead. The solder layer covers the lead and the bump.
Public/Granted literature
- US20130087906A1 CIRCUIT BOARD, FABRICATING METHOD THEREOF AND PACKAGE STRUCTURE Public/Granted day:2013-04-11
Information query
IPC分类:
