Invention Grant
- Patent Title: Printed circuit board comprised of an insulating layer having buried microstrip lines and conductors with widths that narrow into the insulation layer
- Patent Title (中): 印刷电路板由具有埋入微带线的绝缘层和宽度窄到绝缘层中的导体组成
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Application No.: US13621117Application Date: 2012-09-15
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Publication No.: US08674781B2Publication Date: 2014-03-18
- Inventor: Heung-Kyu Kim
- Applicant: Heung-Kyu Kim
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2008-0087265 20080904
- Main IPC: H01P3/08
- IPC: H01P3/08

Abstract:
A printed circuit board having a micro strip line, a printed circuit board having a strip line and a method of manufacturing thereof are disclosed. The printed circuit board having a micro strip line in accordance with an embodiment of the present invention includes a first insulation layer, a signal line buried in one surface of the first insulation layer, a plurality of conductors penetrating through the first insulation layer and being disposed on both sides of the signal line in parallel with the signal line, and a ground layer formed to be electrically connected to the conductor on the other surface of the first insulation layer.
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