Invention Grant
- Patent Title: Wireless IC device and component for wireless IC device
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Application No.: US13567108Application Date: 2012-08-06
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Publication No.: US08676117B2Publication Date: 2014-03-18
- Inventor: Yuya Dokai , Noboru Kato , Satoshi Ishino
- Applicant: Yuya Dokai , Noboru Kato , Satoshi Ishino
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2006-011626 20060119; JP2006-079099 20060322; JP2006-146258 20060526; JP2006-182685 20060630; JP2006-236777 20060831
- Main IPC: H04B5/00
- IPC: H04B5/00

Abstract:
A wireless IC device includes a wireless IC chip, a power supply circuit board upon which the wireless IC chip is mounted, and in which a power supply circuit is provided, the power supply circuit includes a resonant circuit having a predetermined resonant frequency, and a radiation pattern, which is adhered to the underside of the power supply circuit board, for radiating a transmission signal supplied from the power supply circuit, and for receiving a reception signal to supply this to the power supply circuit. The resonant circuit is an LC resonant circuit including an inductance device and capacitance devices. The power supply circuit board is a multilayer rigid board or a single-layer rigid board, and between the wireless IC chip and the radiation pattern is connected by DC connection, magnetic coupling, or capacitive coupling.
Public/Granted literature
- US20120292396A1 WIRELESS IC DEVICE AND COMPONENT FOR WIRELESS IC DEVICE Public/Granted day:2012-11-22
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