Invention Grant
- Patent Title: Device pairing via intermediary device
- Patent Title (中): 通过中间设备进行设备配对
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Application No.: US12927609Application Date: 2010-11-17
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Publication No.: US08676119B2Publication Date: 2014-03-18
- Inventor: Alexander J. Cohen , Edward K. Y. Jung , Royce A. Levien , Robert W. Lord , Mark A. Malamud , John D. Rinaldo, Jr.
- Applicant: Alexander J. Cohen , Edward K. Y. Jung , Royce A. Levien , Robert W. Lord , Mark A. Malamud , John D. Rinaldo, Jr.
- Applicant Address: US WA Bellevue
- Assignee: The Invention Science Fund I, LLC
- Current Assignee: The Invention Science Fund I, LLC
- Current Assignee Address: US WA Bellevue
- Main IPC: H04B7/00
- IPC: H04B7/00
Abstract:
A first device may include and/or involve at least one contact sensor, and logic to facilitate pairing between a second device and a third device as a result of contact between the contact sensor and at least one of the second and third devices.
Public/Granted literature
- US20120096188A1 Device pairing via intermediary device Public/Granted day:2012-04-19
Information query
