Invention Grant
- Patent Title: Reducing impact of repair actions following a switch failure in a switch fabric
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Application No.: US13709283Application Date: 2012-12-10
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Publication No.: US08677175B2Publication Date: 2014-03-18
- Inventor: William J. Armstrong , John M. Borkenhagen , Martin J. Crippen , Dhruv M. Desai , David R. Engebretsen , Philip R. Hillier, III , William G. Holland , James E. Hughes , James A. O'Connor , Steven M. Tri
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Patterson & Sheridan LLP
- Main IPC: G06F11/00
- IPC: G06F11/00

Abstract:
Techniques are disclosed for reducing impact of a switch failure and/or a repair action in a switch fabric. In one embodiment, a server system is provided that includes a first interposer card that operatively connects one or more server cards to a midplane. The first interposer card may include a switch module that switches network traffic for the one or more server cards. The first interposer card may be hot-swappable from the midplane, and the one or more server cards may be hot-swappable from the first interposer card. The server system may further include an interconnect between the first interposer card and a second interposer card.
Public/Granted literature
- US20130100799A1 REDUCING IMPACT OF REPAIR ACTIONS FOLLOWING A SWITCH FAILURE IN A SWITCH FABRIC Public/Granted day:2013-04-25
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