Invention Grant
- Patent Title: Method for manufacturing flex-rigid wiring board
- Patent Title (中): 柔性电路板制造方法
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Application No.: US13291134Application Date: 2011-11-08
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Publication No.: US08677612B2Publication Date: 2014-03-25
- Inventor: Michimasa Takahashi
- Applicant: Michimasa Takahashi
- Applicant Address: JP Ogaki-shi
- Assignee: Ibiden Co., Ltd.
- Current Assignee: Ibiden Co., Ltd.
- Current Assignee Address: JP Ogaki-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K3/46

Abstract:
A method for manufacturing a flex-rigid wiring board, including preparing a flexible wiring board having a flexible base material and having a conductive layer over the flexible base material, making a cut in the flexible wiring board to form a cut portion, and folding at least one portion of the flexible wiring board using the cut portion to form one or more folding portions such that the flexible wiring board is extended in length, and connecting the flexible wiring board to a rigid wiring board including a rigid base material and having a conductive layer over the rigid base material.
Public/Granted literature
- US20120047727A1 FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2012-03-01
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