Invention Grant
- Patent Title: Printed circuit board edge connector
- Patent Title (中): 印刷电路板边缘连接器
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Application No.: US12769259Application Date: 2010-04-28
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Publication No.: US08677617B2Publication Date: 2014-03-25
- Inventor: Brian Samuel Beaman
- Applicant: Brian Samuel Beaman
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Thomas E. Tyson; Steven L. Bennett
- Main IPC: H05K3/40
- IPC: H05K3/40

Abstract:
A printed circuit board assembly and method of assembly is provided for a printed circuit board having a top and bottom surface with at least one edge portion having a rounded surface extending from the top surface to a point below the top surface and at least one electrical contact pad located on the top surface and extending over the edge portion rounded surface to a point below the top surface.
Public/Granted literature
- US20110266042A1 Printed Circuit Board Edge Connector Public/Granted day:2011-11-03
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