Invention Grant
- Patent Title: Joining surface treatment device and method
- Patent Title (中): 连接表面处理装置及方法
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Application No.: US13411593Application Date: 2012-03-04
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Publication No.: US08678060B2Publication Date: 2014-03-25
- Inventor: Siegfried Dietz , Florian Gamringer
- Applicant: Siegfried Dietz , Florian Gamringer
- Applicant Address: DE Fulda
- Assignee: FFT EDAG Produktionssysteme GmbH & Co. KG
- Current Assignee: FFT EDAG Produktionssysteme GmbH & Co. KG
- Current Assignee Address: DE Fulda
- Agency: Von Rohrscheidt Patents
- Priority: EP11157081 20110304
- Main IPC: B29C65/02
- IPC: B29C65/02 ; B29C65/10 ; B32B37/06

Abstract:
A joining surface treatment device and a joining surface treatment method for treating a joining surface of a component which joining surface is used for joining two components, the joining surface treatment device comprising at least one heat source for heating a portion of a surface of a first component at which portion the first component shall be joined with a second component; and a primer application device for applying a primer to a portion of the surface of the first component which portion is heatable by the at least one heat source, wherein the at least one heat source is arranged so that it can heat the first component before and/or after applying the primer.
Public/Granted literature
- US20130092324A1 Joining Surface Treatment Device and Method Public/Granted day:2013-04-18
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