The imprint apparatus of the present invention molds an imprint material on a substrate using a mold and cures the imprint material to form a pattern on the substrate. The apparatus includes a holder configured to attract the mold to hold the mold; and a pressure reduction device configured to reduce a back pressure of the mold held by the holder, wherein the apparatus is configured to reduce the back pressure by the pressure reduction device in parallel with release of the mold from the imprint material.