Invention Grant
- Patent Title: Apparatus and method for repairing an integrated circuit
- Patent Title (中): 用于修复集成电路的装置和方法
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Application No.: US13397567Application Date: 2012-02-15
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Publication No.: US08683276B2Publication Date: 2014-03-25
- Inventor: Yung-Fa Chou , Ding-Ming Kwai
- Applicant: Yung-Fa Chou , Ding-Ming Kwai
- Applicant Address: TW Chutung, Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Chutung, Hsinchu
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, LLP
- Main IPC: G11C29/00
- IPC: G11C29/00 ; G11C7/00

Abstract:
A method for repairing an integrated circuit comprises: fabricating a first circuit, the first circuit including a plurality of regular units and a plurality of redundant units, each of the regular units being identified by an address; performing a first test on the first circuit to determine if a defective regular unit is present; activating, if the defective regular unit is present, at least a first redundant unit to replace the defective regular unit, the first redundant unit being identified by an address of the defective regular unit; performing, if the at least first redundant unit is present, a second test on the first circuit to determine if the first redundant unit is defective; and activating at least a second redundant unit to replace the defective first redundant unit, the second redundant unit being identified by the address of the defective regular unit.
Public/Granted literature
- US20130210170A1 Apparatus And Method For Repairing An Integrated Circuit Public/Granted day:2013-08-15
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