Invention Grant
- Patent Title: Multi-layer distributed network
- Patent Title (中): 多层分布式网络
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Application No.: US13418958Application Date: 2012-03-13
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Publication No.: US08683405B2Publication Date: 2014-03-25
- Inventor: Keong Hong Oh , Yee Liang Tan , Siang Poh Lob , Chooi Pei Lim
- Applicant: Keong Hong Oh , Yee Liang Tan , Siang Poh Lob , Chooi Pei Lim
- Applicant Address: US CA San Jose
- Assignee: Altera Corporation
- Current Assignee: Altera Corporation
- Current Assignee Address: US CA San Jose
- Agency: Womble Carlyle Sandridge & Rice LLP
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
Apparatuses and processes for distributing signals in an integrated circuit are disclosed. An embodiment to use a custom layer together with a base layer on an integrated circuit for testing the integrated circuit includes having a structured network on the base layer. The custom layer connects the network to logic elements on the integrated circuit. The network may be evenly distributed across the base layer of the integrated circuit. Even distribution of the network may reduce skew of the test signals. Buffers are also placed along the structured network. The buffers may be placed to ensure a deterministic test signals distribution. Unused buffers in the base layer may be tied off to reduce current leakage.
Public/Granted literature
- US20120169362A1 MULTI-LAYER DISTRIBUTED NETWORK Public/Granted day:2012-07-05
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