In one or more aspects of the present disclosure, a method is disclosed for fabricating a rigid flex cable assembly. The method includes arranging one or more layers of a polyimide film having an electrically-conductive surface into a stack; applying an adhesive to the one or more layers of polyimide film; arranging a top and a bottom polyimide film to a top portion and a bottom portion of the stack to form the rigid flex circuit board; and selecting a suitable pressure and temperature at which to form the rigid flex assembly such that the one or more layers of polyimide film do not move with respect to one another during the fabrication.