Invention Grant
- Patent Title: Sensor device with stepped pads for connectivity
- Patent Title (中): 传感器设备，带有台阶垫，用于连接
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Application No.: US13420915Application Date: 2012-03-15
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Publication No.: US08683870B2Publication Date: 2014-04-01
- Inventor: James C. Letterneau
- Applicant: James C. Letterneau
- Applicant Address: US CA Irvine
- Assignee: Meggitt (Orange County), Inc.
- Current Assignee: Meggitt (Orange County), Inc.
- Current Assignee Address: US CA Irvine
- Agency: Dickstein Shapiro LLP
- Main IPC: G01B7/16
- IPC: G01B7/16 ; G01L1/00
Abstract:
A sensor device includes at least one sensor device coupled to a substrate. A solder pad interface includes a plurality of steps, with at least a portion of the steps positioned at different planes, each of a step having a solder pad. A cable with a plurality of cable leads, is configured for each of a cable lead to be coupled to a solder pad.
Public/Granted literature
- US20130239696A1 Sensor device with stepped pads for connectivity Public/Granted day:2013-09-19
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