A stencil assembly for use in depositing filling onto wafers includes a stencil tube defining a lengthwise passage for flow of filling, the stencil tube including an outer surface, and at least two axially spaced apart filling outlets passing through a wall of the tube. A first stencil die is positioned along the stencil tube and has an inner surface facing the outer surface of the tube in a region axially aligned with one filling outlet of the stencil tube, the first stencil die including at least one outlet extending from the inner surface of the first stencil die to an outer surface of the first stencil die. A second stencil die is positioned along the stencil tube and spaced from the first stencil die, the second stencil die having an inner surface facing the outer surface of the tube in a region axially aligned with another filling outlet of the stencil tube, the second stencil die including at least one outlet extending from the inner surface of the second stencil die to an outer surface of the second stencil die.