Invention Grant
- Patent Title: Terminal connection structure
- Patent Title (中): 端子连接结构
-
Application No.: US13876074Application Date: 2011-09-29
-
Publication No.: US08684759B2Publication Date: 2014-04-01
- Inventor: Hideomi Adachi , Hidehiko Kuboshima
- Applicant: Hideomi Adachi , Hidehiko Kuboshima
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2010-223680 20101001
- International Application: PCT/JP2011/072456 WO 20110929
- International Announcement: WO2012/043759 WO 20120405
- Main IPC: H01R13/15
- IPC: H01R13/15

Abstract:
A terminal connection structure which is downsized and easily connects terminal fixtures together without producing variation in electric resistance therebetween. The terminal connection structure connects a bus bar connected to an inverter and a second terminal fixture connected to a motor coil. The terminal connection structure includes a first housing receiving a thin-walled portion of the bus bar, a second housing receiving an electric-contact portion of the second terminal fixture and having an insert portion, a clip terminal arranged to make the thin-walled portion closely contact with the electric-contact portion, and a permitting/restricting portion, which permits the clip terminal to be attached to one of the first housing and the second housing when the insert portion is at a predetermined position and restricts the clip terminal from being attached to one of the first housing and the second housing when the insert portion is not at the predetermined position.
Public/Granted literature
- US20130196545A1 TERMINAL CONNECTION STRUCTURE Public/Granted day:2013-08-01
Information query