Invention Grant
US08685007B2 Method and device for forming cut surfaces in a transparent material
有权
用于在透明材料中形成切割表面的方法和装置
- Patent Title: Method and device for forming cut surfaces in a transparent material
- Patent Title (中): 用于在透明材料中形成切割表面的方法和装置
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Application No.: US12936384Application Date: 2009-04-02
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Publication No.: US08685007B2Publication Date: 2014-04-01
- Inventor: Hartmut Vogelsang , Dan Z. Reinstein , Matthias Wottke , Andre Narr , Wilfried Bissmann
- Applicant: Hartmut Vogelsang , Dan Z. Reinstein , Matthias Wottke , Andre Narr , Wilfried Bissmann
- Applicant Address: DE Jena
- Assignee: Carl Zeiss Meditec AG
- Current Assignee: Carl Zeiss Meditec AG
- Current Assignee Address: DE Jena
- Agency: Christensen Fonder P.A.
- Priority: DE102008017772 20080404
- International Application: PCT/EP2009/002400 WO 20090402
- International Announcement: WO2009/121593 WO 20091008
- Main IPC: A61F9/01
- IPC: A61F9/01

Abstract:
A method and a device for forming cut surfaces in a transparent material, particularly in the cornea, by producing optical breakthroughs in the material by application of laser radiation focused into the material. The focal point is adjusted in three dimensions to form the cut surface by the sequential arrangement of optical perforations. The focal point is guided in such a manner that cutting is divided into at least two steps, and in at least one of the steps, the formation of the cut is carried out with a path radius that decreases in size, and in one of the steps, the cut formation is carried out with a path radius that increases in size.
Public/Granted literature
- US20110208171A1 METHOD AND DEVICE FOR FORMING CUT SURFACES IN A TRANSPARENT MATERIAL Public/Granted day:2011-08-25
Information query
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