Invention Grant
- Patent Title: Modular prosthetic foot
- Patent Title (中): 模块化假脚
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Application No.: US13437994Application Date: 2012-04-03
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Publication No.: US08685108B2Publication Date: 2014-04-01
- Inventor: Joseph A. Miller
- Applicant: Joseph A. Miller
- Applicant Address: US DC Washington
- Assignee: The United States of America as represented by the Secretary of the Army
- Current Assignee: The United States of America as represented by the Secretary of the Army
- Current Assignee Address: US DC Washington
- Agent Elizabeth Arwine
- Main IPC: A61F2/68
- IPC: A61F2/68
Abstract:
A modular prosthetic foot includes an ankle component; a forefoot component having a circular part with a rounded top surface and at least one flat side surface, the circular part being connected to a rear part of the forefoot component; a forefoot cushion bumper positioned around the circular part; and a heel component.
Public/Granted literature
- US20120191222A1 Modular Prosthetic Foot Public/Granted day:2012-07-26
Information query
IPC分类:
