Invention Grant
- Patent Title: Method for peeling pressure-sensitive adhesive optical film, and pressure-sensitive adhesive optical film
- Patent Title (中): 剥离粘合型光学薄膜的方法和压敏粘合剂光学薄膜
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Application No.: US12864047Application Date: 2009-01-20
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Publication No.: US08685204B2Publication Date: 2014-04-01
- Inventor: Fumiko Nakano , Yutaka Moroishi , Aimi Matsuura , Toshitsugu Hosokawa , Akiko Tanaka
- Applicant: Fumiko Nakano , Yutaka Moroishi , Aimi Matsuura , Toshitsugu Hosokawa , Akiko Tanaka
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Knobbe, Martens, Olson & Bear LLP
- Priority: JP2008-015079 20080125; JP2009-009115 20090119
- International Application: PCT/JP2009/050773 WO 20090120
- International Announcement: WO2009/093577 WO 20090730
- Main IPC: B32B38/10
- IPC: B32B38/10

Abstract:
An object of the invention is to provide a pressure-sensitive adhesive optical film-peeling method capable of easily detaching the pressure-sensitive adhesive optical film from a glass substrate with no damage to the glass substrate or no adhesive deposit on the glass substrate, and to provide a pressure-sensitive adhesive optical film suitable for use in such a peeling method. The invention is directed to a method for peeling a pressure-sensitive adhesive optical film from an optical film-carrying glass substrate including a glass substrate and the pressure-sensitive adhesive optical film bonded thereto, which includes: exposing the optical film-carrying glass substrate to an environment at a temperature of 40 to 98° C. and a relative humidity of 60 to 99% for three minutes or more; and then peeling the pressure-sensitive adhesive optical film from the glass substrate under the environment.
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