Invention Grant
US08685536B2 Polyamide-imide resin insulating coating material, insulated wire and method of making the same
有权
聚酰胺酰亚胺树脂绝缘涂料，绝缘电线及其制作方法
- Patent Title: Polyamide-imide resin insulating coating material, insulated wire and method of making the same
- Patent Title (中): 聚酰胺酰亚胺树脂绝缘涂料，绝缘电线及其制作方法
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Application No.: US11312834Application Date: 2005-12-21
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Publication No.: US08685536B2Publication Date: 2014-04-01
- Inventor: Hideyuki Kikuchi , Yuzo Yukimori
- Applicant: Hideyuki Kikuchi , Yuzo Yukimori
- Applicant Address: JP Tokyo
- Assignee: Hitachi Metals, Ltd.
- Current Assignee: Hitachi Metals, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JP2005-126811 20050425
- Main IPC: C08G18/34
- IPC: C08G18/34 ; C08G18/76 ; H01B3/30 ; H01B13/06 ; C09D5/25 ; C09D179/08
Abstract:
A polyamide-imide resin insulating coating material, which is obtained by reacting an isocyanate component with an acid component, has a main solvent component of γ-butyrolactone. In the coating material, a total compounding ratio of 4,4′-diphenylmethane diisocyanate (MDI) and trimellitic anhydride (TMA) is 85 to 98 mol %, where the total compounding ratio is given by averaging a compounding ratio of MDI to the isocyanate component and a compounding ration of TMA to the acid component.
Public/Granted literature
- US20060240255A1 Polyamide-imide resin insulating coating material, insulated wire and method of making the same Public/Granted day:2006-10-26
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