Invention Grant
- Patent Title: Method and device for treating a substrate surface of a substrate
- Patent Title (中): 用于处理基材的基材表面的方法和装置
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Application No.: US13502648Application Date: 2010-07-28
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Publication No.: US08685864B2Publication Date: 2014-04-01
- Inventor: Christian Schmid
- Applicant: Christian Schmid
- Applicant Address: DE
- Assignee: Gebr. Schmid GmbH
- Current Assignee: Gebr. Schmid GmbH
- Current Assignee Address: DE
- Agency: Akerman LLP
- Priority: DE102009050845 20091019
- International Application: PCT/EP2010/060985 WO 20100728
- International Announcement: WO2011/047894 WO 20110428
- Main IPC: H01L21/302
- IPC: H01L21/302
Abstract:
In a method for the treatment of a substrate surface of a flat substrate with a process medium at the substrate underside, the process medium has a removing or etching effect on the substrate surface. The substrates are wetted with the process medium from below in a manner lying horizontally. The upwardly facing substrate top side is wetted or covered with water or a corresponding protective liquid over a large area or over the whole area as protection against the process medium acting on the substrate top side.
Public/Granted literature
- US20120234793A1 Method and Device for Treating a Substrate Surface of a Substrate Public/Granted day:2012-09-20
Information query
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