Invention Grant
- Patent Title: Insulating varnish and insulated wire formed by using the same
- Patent Title (中): 绝缘漆和绝缘线通过使用它形成
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Application No.: US13037727Application Date: 2011-03-01
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Publication No.: US08686291B2Publication Date: 2014-04-01
- Inventor: Hideyuki Kikuchi , Hidehito Hanawa
- Applicant: Hideyuki Kikuchi , Hidehito Hanawa
- Applicant Address: JP Tokyo
- Assignee: Hitachi Metals, Ltd.
- Current Assignee: Hitachi Metals, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JP2010-078838 20100330
- Main IPC: H01B7/00
- IPC: H01B7/00

Abstract:
An insulating varnish usable for an insulating coat of an insulated wire on a conductor with a quadrangular cross section contains polyamide-imide resin varnish and organosilica sol mixed with the polyamide-imide resin varnish. The polyamide-imide resin varnish contains solvent and polyamide-imide resin. The organosilica sol contains dispersion medium and silica particles dispersed in the dispersion medium. Cyclic ketones having boiling point in a range of 130 to 180° C. make up 70 to 100 wt % or more of the dispersion medium.
Public/Granted literature
- US20110240331A1 INSULATING VARNISH AND INSULATED WIRE FORMED BY USING THE SAME Public/Granted day:2011-10-06
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