Invention Grant
- Patent Title: Laminated flex circuit layers for electronic device components
- Patent Title (中): 用于电子器件部件的层压柔性电路层
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Application No.: US13220230Application Date: 2011-08-29
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Publication No.: US08686297B2Publication Date: 2014-04-01
- Inventor: Boon W. Shiu , Yi Jiang , Chun-Lung Chen , Robert W. Schlub , Ruben Caballero
- Applicant: Boon W. Shiu , Yi Jiang , Chun-Lung Chen , Robert W. Schlub , Ruben Caballero
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Womble Carlyle Sandridge & Rice, LLP
- Main IPC: H05K1/02
- IPC: H05K1/02

Abstract:
An electronic device may have a housing in which an antenna and a proximity sensor formed from flex circuit structures are mounted. The flex circuit structures may include first and second flex circuit layers. The first and second flex circuit layers may include metal antenna structures and metal proximity sensor electrode structures. Solder may be used to attach electrical components to the flex circuit layers and may be used to electrically connect metal structures on the first and second flex circuit layers to each other. The first and second flex circuit layers may be laminated together using a compressive fixture. The compressive fixture may have a first fixture with a convex surface and a second fixture with a concave surface so that the laminated flex circuit layers are provided with a bend.
Public/Granted literature
- US20130048347A1 LAMINATED FLEX CIRCUIT LAYERS FOR ELECTRONIC DEVICE COMPONENTS Public/Granted day:2013-02-28
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