Invention Grant
US08686337B2 Solid-state imaging device, solid-state imaging device manufacturing method, electronic device, and lens array
有权
固态成像装置,固态成像装置制造方法,电子装置和透镜阵列
- Patent Title: Solid-state imaging device, solid-state imaging device manufacturing method, electronic device, and lens array
- Patent Title (中): 固态成像装置,固态成像装置制造方法,电子装置和透镜阵列
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Application No.: US12886952Application Date: 2010-09-21
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Publication No.: US08686337B2Publication Date: 2014-04-01
- Inventor: Akiko Ogino , Yoichi Otsuka
- Applicant: Akiko Ogino , Yoichi Otsuka
- Applicant Address: JP
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP
- Agency: Sheridan Ross P.C.
- Priority: JP2009-225159 20090929
- Main IPC: H01L27/00
- IPC: H01L27/00 ; H01J3/14

Abstract:
A solid-state imaging device includes: multiple micro lenses, which are disposed in each of a first direction and a second direction orthogonal to the first direction, focus the incident light into the light-receiving surface; with the multiple micro lenses of which the planar shape is a shape including a portion divided by a side extending in the first direction and a side extending in the second direction being disposed arrayed mutually adjacent to each of the first direction and the second direction; and with the multiple micro lenses being formed so that the depth of a groove between micro lenses arrayed in a third direction is deeper than the depth of a groove between micro lenses arrayed in the first direction, and also the curvature of the lens surface in the third direction is higher than the curvature of the lens surface in the first direction.
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