Invention Grant
- Patent Title: Integrated circuit semiconductor devices including channel trenches and related methods of manufacturing
- Patent Title (中): 集成电路半导体器件包括沟槽和相关的制造方法
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Application No.: US13349714Application Date: 2012-01-13
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Publication No.: US08686393B2Publication Date: 2014-04-01
- Inventor: Jihyung Yu , Daewon Ha , Song yi Kim
- Applicant: Jihyung Yu , Daewon Ha , Song yi Kim
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel Sibley & Sajovec, P.A.
- Priority: KR10-2011-0028315 20110329
- Main IPC: H01L29/06
- IPC: H01L29/06

Abstract:
An integrated circuit device may include a semiconductor substrate including an active region and a transistor in the active region. The transistor may include first and second spaced apart source/drain regions in the active region of the semiconductor substrate, and a semiconductor channel region between the first and second source/drain regions. The semiconductor channel region may include a plurality of channel trenches therein between the first and second source/drain regions. A gate insulating layer may be provided on the channel region including sidewalls of the plurality of channel trenches, and a gate electrode may be provided on the gate insulating layer so that the gate insulating layer is between the gate electrode and the semiconductor channel region including the plurality of channel trenches. Related methods are also discussed.
Public/Granted literature
- US20120248400A1 Integrated Circuit Semiconductor Devices Including Channel Trenches And Related Methods Of Manufacturing Public/Granted day:2012-10-04
Information query
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