Invention Grant
US08686419B2 Structure and fabrication method for resistance-change memory cell in 3-D memory 有权
3-D存储器中电阻变化存储单元的结构和制造方法

Structure and fabrication method for resistance-change memory cell in 3-D memory
Abstract:
A memory device in a 3-D read and write memory includes a resistance-changing layer, and a local contact resistance in series with, and local to, the resistance-changing layer. The local contact resistance is established by a junction between a semiconductor layer and a metal layer. Further, the local contact resistance has a specified level of resistance according to a doping concentration of the semiconductor and a barrier height of the junction. A method for fabricating such a memory device is also presented.
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