Invention Grant
US08686419B2 Structure and fabrication method for resistance-change memory cell in 3-D memory
有权
3-D存储器中电阻变化存储单元的结构和制造方法
- Patent Title: Structure and fabrication method for resistance-change memory cell in 3-D memory
- Patent Title (中): 3-D存储器中电阻变化存储单元的结构和制造方法
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Application No.: US13029361Application Date: 2011-02-17
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Publication No.: US08686419B2Publication Date: 2014-04-01
- Inventor: Franz Kreupl , Deepak C Sekar
- Applicant: Franz Kreupl , Deepak C Sekar
- Applicant Address: US CA Milpitas
- Assignee: SanDisk 3D LLC
- Current Assignee: SanDisk 3D LLC
- Current Assignee Address: US CA Milpitas
- Agency: Vierra Magen Marcus LLP
- Main IPC: H01L45/00
- IPC: H01L45/00

Abstract:
A memory device in a 3-D read and write memory includes a resistance-changing layer, and a local contact resistance in series with, and local to, the resistance-changing layer. The local contact resistance is established by a junction between a semiconductor layer and a metal layer. Further, the local contact resistance has a specified level of resistance according to a doping concentration of the semiconductor and a barrier height of the junction. A method for fabricating such a memory device is also presented.
Public/Granted literature
- US20110204316A1 Structure And Fabrication Method For Resistance-Change Memory Cell In 3-D Memory Public/Granted day:2011-08-25
Information query
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