Invention Grant
- Patent Title: Light emitting device and light emitting device package
- Patent Title (中): 发光器件和发光器件封装
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Application No.: US13601527Application Date: 2012-08-31
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Publication No.: US08686433B2Publication Date: 2014-04-01
- Inventor: Nobuaki Matsui , Hirotaka Obuchi , Yasuo Nakanishi , Kazuaki Tsutsumi , Takao Fujimori
- Applicant: Nobuaki Matsui , Hirotaka Obuchi , Yasuo Nakanishi , Kazuaki Tsutsumi , Takao Fujimori
- Applicant Address: JP Kyoto
- Assignee: Rohm Co., Ltd.
- Current Assignee: Rohm Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Rabin & Berdo, P.C.
- Priority: JP2011-190880 20110901; JP2011-193900 20110906
- Main IPC: H01L33/32
- IPC: H01L33/32

Abstract:
A light emitting device includes a light emitting layer, a substrate that is transparent to an emission wavelength of the light emitting layer and positioned to receive an emission wavelength from the light emitting layer, a convex pattern including a collection of a plurality of convex portions discretely arranged on a front surface of the substrate with a first pitch, an n type nitride semiconductor layer located on the front surface of the substrate to cover the convex pattern and a p type nitride semiconductor layer located on the light emitting layer. The light emitting layer is located on the n type semiconductor layer. Each of the convex portions includes a sub convex pattern comprising a plurality of fine convex portions discretely formed at the top of the convex portion with a second pitch smaller than the first pitch, and a base supporting the sub convex pattern.
Public/Granted literature
- US20130056748A1 LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE Public/Granted day:2013-03-07
Information query
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