Invention Grant
- Patent Title: Light emitting device, light emitting device package, and light unit
- Patent Title (中): 发光装置,发光装置封装和灯单元
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Application No.: US13217526Application Date: 2011-08-25
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Publication No.: US08686456B2Publication Date: 2014-04-01
- Inventor: Hwan Hee Jeong
- Applicant: Hwan Hee Jeong
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Ked & Associates, LLP
- Priority: KR10-2010-0083162 20100826
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L21/00

Abstract:
Provided are a light emitting device, a light emitting device package, and a light unit. The light emitting device includes a support substrate, a light emitting structure layer disposed on the support substrate, the light emitting structure layer including a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer disposed between the first conductive type semiconductor layer and the second conductive type semiconductor layer, an electrode electrically connected to the first conductive type semiconductor layer, and a volume layer disposed on the light emitting structure layer, the volume layer having a thickness greater than a thickness of the electrode.
Public/Granted literature
- US20120049226A1 LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE, AND LIGHT UNIT Public/Granted day:2012-03-01
Information query
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