Invention Grant
- Patent Title: Semiconductor substrate, electronic device and method for manufacturing semiconductor substrate
- Patent Title (中): 半导体衬底,电子器件和半导体衬底的制造方法
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Application No.: US13122124Application Date: 2009-10-01
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Publication No.: US08686472B2Publication Date: 2014-04-01
- Inventor: Masahiko Hata
- Applicant: Masahiko Hata
- Applicant Address: JP Tokyo
- Assignee: Sumitomo Chemical Company, Limited
- Current Assignee: Sumitomo Chemical Company, Limited
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2008-257856 20081002; JP2008-334830 20081226; JP2009-046587 20090227
- International Application: PCT/JP2009/005068 WO 20091001
- International Announcement: WO2010/038461 WO 20100408
- Main IPC: H01L21/02
- IPC: H01L21/02

Abstract:
There is provided a semiconductor wafer including a base wafer, an insulating layer, and a Si crystal layer in the stated order. The semiconductor wafer further includes an inhibition layer that is provided on the Si crystal layer and has an opening penetrating therethrough to reach the Si crystal layer. The inhibition layer inhibiting crystal growth of a compound semiconductor. Furthermore, a seed crystal is provided within the opening, and a compound semiconductor has a lattice match or a pseudo lattice match with the seed crystal. There is also provided an electronic device includes a substrate, an insulating layer that is provided on the substrate, a Si crystal layer that is provided on the insulating layer, an inhibition layer that is provided on the Si crystal layer and has an opening penetrating therethrough to reach the Si crystal layer, where the inhibition layer inhibits crystal growth of a compound semiconductor, a seed crystal that is provided within the opening, a compound semiconductor that has a lattice match or a pseudo lattice match with the seed crystal, and a semiconductor device that is formed using the compound semiconductor.
Public/Granted literature
- US20110266595A1 SEMICONDUCTOR SUBSTRATE, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE Public/Granted day:2011-11-03
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