Invention Grant
- Patent Title: Semiconductor structure and method for manufacturing the same
- Patent Title (中): 半导体结构及其制造方法
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Application No.: US13369643Application Date: 2012-02-09
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Publication No.: US08686509B2Publication Date: 2014-04-01
- Inventor: Chien-Chih Chen , Li-Fan Chen , Cheng-Chi Lin , Shin-Chin Lien , Shyi-Yuan Wu
- Applicant: Chien-Chih Chen , Li-Fan Chen , Cheng-Chi Lin , Shin-Chin Lien , Shyi-Yuan Wu
- Applicant Address: TW Hsinchu
- Assignee: Macronix International Co., Ltd.
- Current Assignee: Macronix International Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L23/62
- IPC: H01L23/62 ; H01L21/82

Abstract:
A semiconductor structure and a method for manufacturing the same are provided. The semiconductor structure comprises a first doped region and a second doped region. The first doped region comprises a first contact region. The first doped region and the first contact region have a first type conductivity. The second doped region comprises a second contact region. The second doped region and the second contact region have a second type conductivity opposite to the first type conductivity. The first doped region is adjacent to the second doped region.
Public/Granted literature
- US20130207191A1 SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2013-08-15
Information query
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