Invention Grant
- Patent Title: Semiconductor device having an annular guard ring
- Patent Title (中): 具有环形保护环的半导体器件
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Application No.: US13175367Application Date: 2011-07-01
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Publication No.: US08686532B2Publication Date: 2014-04-01
- Inventor: Yasutaka Nakashiba
- Applicant: Yasutaka Nakashiba
- Applicant Address: JP Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Young & Thompson
- Priority: JP2004-332349 20041116
- Main IPC: H01L29/02
- IPC: H01L29/02

Abstract:
A semiconductor chip 100 includes a logic unit and an analog unit 153. Furthermore, the semiconductor chip 100 includes a silicon substrate 101; a first insulating film 123 to a sixth insulating film 143 formed on the silicon substrate 101; and an annular seal ring 105 consisting of a first conductive ring 125 to a sixth conductive ring 145 buried in the first insulating film 123 to the sixth insulating film 143, which surrounds the periphery of the logic unit and the analog unit 153. In the seal ring region 106, there is formed a pn junction acting as a nonconducting part 104, which blocks conduction in a path from the logic unit, through the seal ring 105 to the analog unit 153.
Public/Granted literature
- US20110260260A1 SEMICONDUCTOR DEVICE HAVING AN ANNULAR GUARD RING Public/Granted day:2011-10-27
Information query
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