- Patent Title: Apparatus and methods for reducing impact of high RF loss plating
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Application No.: US13040137Application Date: 2011-03-03
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Publication No.: US08686537B2Publication Date: 2014-04-01
- Inventor: Weimin Sun , Peter J. Zampardi , Hongxiao Shao
- Applicant: Weimin Sun , Peter J. Zampardi , Hongxiao Shao
- Applicant Address: US MA Wobum
- Assignee: Skyworks Solutions, Inc.
- Current Assignee: Skyworks Solutions, Inc.
- Current Assignee Address: US MA Wobum
- Agency: Knobbe, Martens, Olson & Bear LLP
- Main IPC: H01L29/00
- IPC: H01L29/00 ; H01L29/80

Abstract:
To reduce the radio frequency (RF) losses associated with high RF loss plating, such as, for example, Nickel/Palladium/Gold (Ni/Pd/Au) plating, an on-die passive device, such as a capacitor, resistor, or inductor, associated with a radio frequency integrated circuit (RFIC) is placed in an RF upper signal path with respect to the RF signal output of the RFIC. By placing the on-die passive device in the RF upper signal path, the RF current does not directly pass through the high RF loss plating material of the passive device bonding pad.
Public/Granted literature
- US20120223422A1 APPARATUS AND METHODS FOR REDUCING IMPACT OF HIGH RF LOSS PLATING Public/Granted day:2012-09-06
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