Invention Grant
- Patent Title: Thermally and electrically enhanced ball grid array package
- Patent Title (中): 电加热球栅阵列封装
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Application No.: US13224933Application Date: 2011-09-02
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Publication No.: US08686558B2Publication Date: 2014-04-01
- Inventor: Sam Ziqun Zhao , Reza-ur Rahman Khan , Edward Law , Marc Papageorge
- Applicant: Sam Ziqun Zhao , Reza-ur Rahman Khan , Edward Law , Marc Papageorge
- Applicant Address: US CA Irvine
- Assignee: Broadcom Corporation
- Current Assignee: Broadcom Corporation
- Current Assignee Address: US CA Irvine
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- Main IPC: H01L23/10
- IPC: H01L23/10 ; H01L23/34
Abstract:
In one embodiment, a method for assembling a ball grid array (BGA) package is provided. The method includes providing a stiffener that has opposing first and second surfaces, wherein the first surface is capable of mounting an integrated circuit (IC) die in a central area and forming a pattern in at least a portion of the first surface to enhance the adhesiveness of an encapsulant material to the first surface.
Public/Granted literature
- US20110318885A1 Thermally and Electrically Enhanced Ball Grid Array Package Public/Granted day:2011-12-29
Information query
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