Invention Grant
- Patent Title: Composite substrate and method for manufacturing the same
- Patent Title (中): 复合基板及其制造方法
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Application No.: US13386854Application Date: 2010-07-21
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Publication No.: US08686622B2Publication Date: 2014-04-01
- Inventor: Hiroki Kobayashi , Yuji Hori , Yasunori Iwasaki
- Applicant: Hiroki Kobayashi , Yuji Hori , Yasunori Iwasaki
- Applicant Address: JP Aichi-prefecture
- Assignee: NGK Insulators, Ltd.
- Current Assignee: NGK Insulators, Ltd.
- Current Assignee Address: JP Aichi-prefecture
- Agency: Cermak Nakajima LLP
- Agent Tomoko Nakajima
- Priority: JP2009-177587 20090730
- International Application: PCT/JP2010/062238 WO 20100721
- International Announcement: WO2011/013553 WO 20110203
- Main IPC: H01L41/09
- IPC: H01L41/09 ; H01L41/22

Abstract:
The composite substrate is a substrate used to manufacture an acoustic wave device, and includes a support substrate, a piezoelectric substrate, and a adhesive layer with which the support substrate and the piezoelectric substrate are bonded to each other. In the composite substrate, assuming that a surface of the piezoelectric substrate that is bonded to the support substrate is defined as a first surface and a surface at the side opposite to the first surface is defined as a second surface, the piezoelectric substrate is formed such that the first surface is inside the second surface when the first surface is projected onto the second surface in a direction perpendicular to the second surface. In other words, the composite substrate has an outer peripheral surface that is formed such that the circumference thereof increases toward the top surface of the piezoelectric substrate.
Public/Granted literature
- US20120126669A1 COMPOSITE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2012-05-24
Information query
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