Invention Grant
- Patent Title: Substrate, substrate holding apparatus, analysis apparatus, program, detection system, semiconductor device, display apparatus, and semiconductor manufacturing apparatus
- Patent Title (中): 基板,基板保持装置,分析装置,程序,检测系统,半导体装置,显示装置和半导体制造装置
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Application No.: US12592219Application Date: 2009-11-19
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Publication No.: US08686743B2Publication Date: 2014-04-01
- Inventor: Yuji Furumura , Naomi Mura , Koki Tamagawa , Tadayoshi Yoshikawa , Hiroshi Yonekura
- Applicant: Yuji Furumura , Naomi Mura , Koki Tamagawa , Tadayoshi Yoshikawa , Hiroshi Yonekura
- Applicant Address: JP Bunkyou-Ku JP Nagano
- Assignee: Philtech Inc.,Shinko Electric Industries Co., Ltd.
- Current Assignee: Philtech Inc.,Shinko Electric Industries Co., Ltd.
- Current Assignee Address: JP Bunkyou-Ku JP Nagano
- Agency: Edwards Wildman Palmer LLP
- Agent Jeffrey D. Hsi; Jonathan P. Western
- Priority: JP2008-307823 20081202
- Main IPC: G01R27/28
- IPC: G01R27/28

Abstract:
A substrate including a sensor unit, wherein the sensor unit includes a coil wound at least once arranged on the surface of the sensor or embedded within and near the surface thereof. With such an arrangement, an electric current that corresponds to information with respect to the substrate (e.g., the temperature of the substrate or the amount of charge stored in the substrate) flows through the coil.
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