Invention Grant
- Patent Title: PTC element and heating-element module
- Patent Title (中): PTC元件和加热元件模块
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Application No.: US13639804Application Date: 2011-04-06
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Publication No.: US08686827B2Publication Date: 2014-04-01
- Inventor: Takesha Shimada , Kentaro Ino , Toshiki Kida
- Applicant: Takesha Shimada , Kentaro Ino , Toshiki Kida
- Applicant Address: JP Tokyo
- Assignee: Hitachi Metals, Ltd.
- Current Assignee: Hitachi Metals, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Stein IP, LLC
- Priority: JP2010-089758 20100408
- International Application: PCT/JP2011/058681 WO 20110406
- International Announcement: WO2011/126040 WO 20111013
- Main IPC: H01C7/10
- IPC: H01C7/10

Abstract:
An object is to provide a PTC element that can be made thinner, using a Pb-free semiconductor ceramic composition.The object is achieved with a PTC element including at least two metal electrodes and a BaTiO3 system semiconductor ceramic composition arranged between the electrodes, in which, in the semiconductor ceramic composition, a portion of Ba in the BaTiO3 system is substituted by Bi—Na and a semiconductorizing element, vacancies are formed on Bi sites by depleting at least a portion of Bi, and oxygen defects are formed on a crystal thereof. Since the PTCR characteristic at the inside of the semiconductor ceramic composition is negligibly weak in comparison with the PTCR characteristic at the interface between the semiconductor ceramic composition and the electrodes, the PTC element can be made thinner.
Public/Granted literature
- US20130037904A1 PTC ELEMENT AND HEATING-ELEMENT MODULE Public/Granted day:2013-02-14
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