Invention Grant
US08686870B2 Physical layer management for interconnect configurations using RFID chip technology
有权
使用RFID芯片技术的互连配置的物理层管理
- Patent Title: Physical layer management for interconnect configurations using RFID chip technology
- Patent Title (中): 使用RFID芯片技术的互连配置的物理层管理
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Application No.: US13255826Application Date: 2010-03-26
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Publication No.: US08686870B2Publication Date: 2014-04-01
- Inventor: Jack E. Caveney , Ronald A. Nordin
- Applicant: Jack E. Caveney , Ronald A. Nordin
- Applicant Address: US IL Tinley Park
- Assignee: Panduit Corp.
- Current Assignee: Panduit Corp.
- Current Assignee Address: US IL Tinley Park
- Agent Christopher S. Clancy; Christopher K. Marlow
- International Application: PCT/US2010/028866 WO 20100326
- International Announcement: WO2010/111616 WO 20100930
- Main IPC: G08B21/00
- IPC: G08B21/00 ; G08B13/14 ; G06K19/077 ; H01R13/641 ; H01R13/717

Abstract:
An intelligent physical layer management system is provided that includes active electronic hardware, firmware, mechanical assemblies, cables, and software that guide, monitor, and report on the process of connecting and disconnecting patch cords plugs in an interconnect patching environment. RFID tag integrated chips are used to identify which switch port a patch cord is plugged into. The system is capable of monitoring patch cord connections to detect insertions or removals of patch cords or plugs. In addition, the system can map the patch field in interconnect configurations.
Public/Granted literature
- US20120045928A1 PHYSICAL LAYER MANAGEMENT FOR INTERCONNECT CONFIGURATIONS USING RFID CHIP TECHNOLOGY Public/Granted day:2012-02-23
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